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TIA RZ/V2H

The new form factor for the Engicam module is suitable for a wide range of applications, such as machine vision, autonomous robots, and factory automation. The SOM is based on RENESAS® RZ/V2H processor with AI accelerator (DRP-AI) with 8TOPS/dense, 80TOPS/sparse, GE3D 3D GPU. Aimed for powerful vision, machine automation, and real-time processing.

CPU RENESAS® RZ/V2H
AI CAPABILITIES AI Accelerator DRP-AI3
MAC INTERFACE RGMII interface
DIMENSIONS 35 x 55 mm

Specifications

CPU

  • RENESAS® RZ/V2H
  • Manufacturer: Renesas
  • NPU
  • GPU

Cores

  • ARM
  • 4x Arm Cortex-A55, up to 1.8 GHz
    2x Arm Cortex-R8, up to 800 MHz
    1x Arm Cortex-M33, up to 200 MHz

Memory

  • LPDDR4X@3200MTs
  • 8GB up to 16GB

Graphics & AI

  • AI Accelerator DRP-AI3
     - 8TOPS/dense
     - 80TOPS/sparse
    Mali™-G31 (GE3D)
    Mali™-C55 (ISP)
    OpenGL ES™ 1.1, 2.0, and 3.2
    OpenCL 2.0

Video Processing Unit Capabilities

  • H.265/H.264 decode and encode
    1920 x 1080 @60 H.264
    3840 x 2160 @30 H.265

Mass Storage

  • Starting from 8GB eMMC drive soldered on-board

Networking

  • 1x 1Gb Ethernet

USB

  • 1x OTG
  • 1x USB2
  • 2x USB3

PCIe

  • 1
  • PCIe interface GEN3/4-lane

Audio

  • I2S Interface

Peripheral Interfaces

  • UART
    SPI
    I2C
    CAN Bus
    GPIOs
    JTAG
    MIPI-CSI 4x 4-lane
    RGMII Interface

Power Supply

  • single 5V

Operating Temperature

  • -40° up to 85°
  • (CPU TJ +125°)

Dimensions

  • 35 x 55 mm

Product availability

  • 2036

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Fact Sheet

Hardware manual

3D

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