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Platform overview

Modular building blocks designed to power scalable embedded systems.

Consultancy
Enclosure
Heatsink
System-on-Module
Carrier Board
HMI Display
Mechanical

Enclosure

Enclosures and mechanical parts are fully customizable to meet application-specific requirements, leveraging the most suitable technologies for both small-batch and high-volume production.

Passive Cooling Active Cooling Thermal Simulation
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Thermal

Heatsink

Custom thermal cooling solutions are engineered to meet mechanical and performance requirements across the full operating temperature range, with passive and active dissipation options validated through comprehensive simulation.

Heatspreader Heatsink
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Processing

System-on-Module

ARM- and x86-based System on Modules, featuring the leading CPU manufacturers and available in multiple form factors to suit a wide range of applications.

ARM x86
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Connectivity

Carrier Board

Standard and custom carrier boards with a variety of peripherals and form factors, either selected from existing designs or fully engineered from scratch based on customer specifications.

Connectivity Industrial I/O LCD interface
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Interface

HMI Display

A wide range of LCD solutions is available, differing in size, resolution, brightness, and driving interface, complemented by mechanical designs tailored to project requirements.

Capacitive Touch IPS High Brightness
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SERVICES

Consultancy

Developer ecosystem

Tools, resources and documentation to accelerate your embedded development workflow.