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COMe 6C-ADLP

The new Engicam COMe module, based on Intel® processors ALDER LAKE™, enables IoT applications with up to 1.36x times faster in single-thread performance  and up to 1.35x times faster in multi-thread performance  vs. the previous generation processors.

CPU Intel®Alder Lake
RAM LPDDR5@5200MTs
LAN PHY 1x 2.5 GbE
DIMENSIONS 95 x 95 mm

Specifications

CPU

  • Intel®Alder Lake
  • Manufacturer: Intel
  • GPU

Cores

  • x86
  • i7-12800HE, i5-12600HE, i3-12300HE, i7-1270PE, i5-1250PE, i3-1220PE, i7-1265UE, i5-1245UE, i3-1215UE, Celeron 7305E

Memory

  • LPDDR5@5200MTs
  • 8GB up to 16GB

Graphics & AI

  • Intel® Iris Xe Graphics architecture Intel® Deep Learning Boost (VNNI) DirectX 12.1, OpenGL 3.0, IPU 6.0

Video Processing Unit Capabilities

  • HEVC/H.265, AVC/H.264, VP9, JPEG/MJPEG dec HEVC/H.265, AVC/H.264, VP9, JPEG enc

Mass Storage

  • Starting from 64 NVMe PCIe

Networking

  • 1x 2.5 Gb Ethernet

USB

  • 8x USB2
  • 4x USB3

PCIe

  • 8
  • PCIe interface Gen3/up to 8-lane

Audio

  • HDA Interface

Peripheral Interfaces

  • SM Bus, I2C, LPC/eSPI (option), UART, GPIOs, CSI connector, JTAG EC connector

Power Supply

  • +8.5 to 20 V

Dimensions

  • 95 x 95 mm

Product availability

  • 2034

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Fact Sheet

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PCN

3D

Compatible Carrier Boards

A selection of carrier boards tested and validated for reliable operation with this module.

COMe Board

COMe Carrier Board compliant with standard COM Express type 6 and basic COM Express type 10

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